| 摘要 |
PROBLEM TO BE SOLVED: To create a short path reaching a thermal from the heating surface of a semiconductor element via a bump by aligning the thermal via of a wiring substrate to the bump of the semiconductor element and connecting them each other. SOLUTION: A semiconductor element 101 is electrically connected to wiring 103 that is arranged on a wiring substrate 105 by a plurality of bumps 102, and an underfill 106 is arranged between the semiconductor element 101 and the wiring substrate 105 for assisting in mechanical connection. Then, a bump 108 is arranged also directly below an active region 107 in the semiconductor element 101, and the bump 108 is located below the active region 107 of the semiconductor element 101 and is created lower than other bumps 102 so that the bump 108 does not touch them. A thermal via 104 is arranged directly below this sort of the bump 108, and the thermal via 104 is aligned with the bump 108 and they are connected each other. |
