| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an electronic component arranged in a housing efficiently and at a low cost by imbedding the electronic component in a hot-melt adhesive and fixing it and later forming the housing by an extrusion coating process. SOLUTION: First an electronic part is fixed in a hot-melt adhesive 7 and thus a housing 8 is formed by a finish extrusion coating process. The housing 8 is formed by the finish extrusion coating process which is a high pressure process, together with an outer part. Polyamide, a duroplastic material or any other material can be used as a finish extrusion coat. Generally a sensitive electronic part like a sensor board 4 can be arranged not only by extrusion- coating the electronic part by a low pressure process but also by imbedding the electronic part in the hot-melt adhesive 7. Since the sensitive electronic part is fixed with the hot-melt adhesive 7, it is possible to perform the finish extrusion coating process as a consecutive procedure.
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