MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, where a fine connection is easily made to realize a semiconductor device of high performance. SOLUTION: Adhesive agent 6 is applied on a semiconductor wafer 2 formed of a first semiconductor chip 1 so as not to cover an inner electrode 5 and an outer electrode 4, and a second semiconductor chip 7 is installed facing downward on the first semiconductor chip 1 so as to make inner electrodes 5 and 8 coincident with each other. After the adhesive agent 6 is cured, the semiconductor chip 7 bonded to the semiconductor wafer 2 is dipped into an electroless plating liquid tank 11, and an electroless plating liquid 10 is made to permeate the spacing between the semiconductor chip 7 and the semiconductor wafer 2. The inner electrode 6 of the first semiconductor chip 1 and the inner electrode 8 of the second semiconductor chip 7 are electrically connected together with a deposited metal 12 separated out from the electrode 5 and 8.