| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket capable of executing the accurate electrical test for a long period under a temperature of 150 deg.C. SOLUTION: In an IC socket 1, a positioning film 4, an insulating resin film 3 and a pressure jig 5 are sequentially stacked, positioned and fixed on a supporting board 2. The insulating resin film 3 comprises a circuit pattern on which a plurality of conductive contact pads are formed corresponding to a plurality of bumps 21 of an IC 10, and which electrically connects the contact pads with an external electrical test circuit, and is made of a material capable of elastically deforming at a temperature of 150 deg.C for a long period. The supporting board 2 comprises the openings 22 for receiving the bumps 21 on the places corresponding to the bumps 21 (contact pads). When the IC 10 is pressed to the pressure jig 5, the insulating resin film 3 is elastically deformed in the openings 22 by the bumps 21, so that the contact pressure is generated on the contact parts of the bumps 21 and the contact pads. |
