发明名称 SUBSTRATE HAVING AUTO-FOCUS ADJUSTING MARK, AUTO-FOCUS ADJUSTING METHOD, AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To place an auto-focus adjusting mark at the same height as the surface of a wafer and make easy its sensing, by forming it in the non-pattern forming region of the substrate of an adjusted object, and by constituting it out of openings in each of which a contrast pattern is formed. SOLUTION: In the central portion of a pattern forming region, a circuit pattern forming region is provided for a focus adjusting mark in a non-pattern forming region formed in the periphery of the circuit-pattern forming region. In the focus adjusting mark, as a unit 22, six openings 20 having respective contrast patterns therein are used to so form the mark as for the units 22 not to overlap with each other. Further, the plurality of units 22 are so provided that each of scanning lines 26a, 26b, 26c extended in a plurality of directions intersects at least one of all the openings 20 included in the plurality of units 22.
申请公布号 JP2000156334(A) 申请公布日期 2000.06.06
申请号 JP19980329768 申请日期 1998.11.19
申请人 OKI ELECTRIC IND CO LTD 发明人 MUTOU KOUKI
分类号 H01L21/027;G03F9/02;(IPC1-7):H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址