发明名称 |
DRYING APPARATUS FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a drying apparatus for shortening a drying time of a wafer while the wafer is rotated in a supported state by fitting a substrate supporting member to an outer circumferential part of the substrate. SOLUTION: An atmosphere shielding plate 12 has four nozzles 28 at a position in accordance with a chuck pin 8, and an outlet opening 28a of each nozzle 28 is put opposite to the shuck pin 8. Each nozzle 28 is connected to a temperature control N2 gas feeding part 34 with a pipe 30 through a valve 32. When the valve 32 is opened by a command from a control part 22, high-temperature nitrogen gas (high-temperature N2 gas) is fed to each nozzle 28 and spouted from the outlet opening 28a to the chuck pin 8. In this way the high-temperature nitrogen gas is spouted to the chuck pin 8 to promote a drying treatment step at a fitting part 36 between the chuck pin 8 and a substrate (S).
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申请公布号 |
JP2000156363(A) |
申请公布日期 |
2000.06.06 |
申请号 |
JP19980329769 |
申请日期 |
1998.11.19 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
KIYOSE HIROMI |
分类号 |
H01L21/304;F26B3/04;F26B5/08;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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