| 摘要 |
PROBLEM TO BE SOLVED: To laminate a plurality of semiconductor chips, sealing them with a resin-sealing body, and make thin a semiconductor device by adhering and fixing first and second semiconductor chips while the surface and backside face each other and the positions are shifted in the direction that orthogonally crosses the arrangement direction of an electrode. SOLUTION: Semiconductor chips 4 and 5 are adhered and fixed via an adhesive layer 7 while the backsides face each other so that the other long side 4A2 of the semiconductor chips and one long side 5A1 face the side of a lead 10B. Then, the laminates of the semiconductor chips 4 and 5 are supported by a support lead 8, and the support lead 8 is adhered and fixed to a main surface 4A of the semiconductor chip 4 via the adhesive layer 8. As a result, no tabs exist between the semiconductor chips 4 and 5 and at the same time only one adhesive layer exists, thus reducing distance from the main surface 4A of the semiconductor chip to a main surface 5A. |
