| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooling system which can keep a semiconductor chip at low temperature while securing reliability on a freezer unit, and besides is compact. SOLUTION: This system is provided with a heater 11, or a cooler, or both of them which are controlled by the power consumption ripple of a semiconductor module, within an evaporator 7 or the module. Moreover, the compressor 8 or the decompressor 10 of the freezer unit is controlled, too, at the same time when the heater 11 or the cooler is controlled.</p> |
