发明名称 TEMPERATURE-CONTROLLED MICROCHIP LASER ASSEMBLY AND ASSOCIATED SUBMOUNT ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To accurately control the temperature of a microchip laser by allowing a housing to include an outer body for limiting an inner cavity and an inner frame being arranged in the inner cavity and arranging a microchip laser in the inner frame of the housing. SOLUTION: A housing 30 includes an outer body 32, and an inner frame 34 that is connected to the outer body 32 for accommodating a microchip laser and at the same time eliminates heat being generated by the microchip laser during its operation. Then, a Peltier cooling element 38 is arranged between the outer body 32 and the inner frame 34 and is electrically transferred to a Peltier drive contact 40 being extended through the through hole of the outer body 32 of the housing 30. A controller controls the polarity and direction of a DC current that is applied to each Peltier cooling element 38 according to feedback from a thermistor 36 via a thermistor contact 42, thus controlling the temperature of the microchip laser within a predetermined temperature range.
申请公布号 JP2000156538(A) 申请公布日期 2000.06.06
申请号 JP19990308495 申请日期 1999.10.29
申请人 LITTON SYST INC 发明人 PETERSON BRIAN L
分类号 H01S5/024;H01S3/02;H01S3/042;H01S3/06;H01S3/0941;H01S5/022;(IPC1-7):H01S5/024 主分类号 H01S5/024
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