| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a micropump and to prevent a chemical reaction of each member and a working fluid by opposing and overlapping surfaces to be jointed in vacuum or inactive atmosphere and pressurizing and joining the surfaces to be joined after a member forming the micropump is made as a silicon substrate, metallic films are formed on the whole of surfaces to be joined sides and the silicon substrate and the metallic films are cleaned. SOLUTION: In each substrate forming a micropump, monocrystal silicon is made as a base material. After etching working is performed for a chamber and valve substrates 20, 30 at first and thermal oxidation films are formed on the whole surface of each substrate, metallic films are formed on the whole of surfaces to be joined of both substrates and surfaces to be joined are formed. Subsequently, after Ar plasma is irradiated in vacuum, continuously opposed surfaces are opposed in vacuum and joining and positioning are performed, the surfaces are overlapped and the surfaces are joined by heating and pressurizing. Next, metallic films are formed on the whole of each surface to be joined of this joining body and a nozzle substrate 40, surfaces to be joined are formed, surfaces to be joined are joined in the same procedure, metallic films are formed on the whole of each surface to be joined side of this joining body and a diaphragm substrate 10 and surfaces to be joined are joined in the same procedure.
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