发明名称 SILICON CARBIDE COMPOSITE BODY
摘要 PROBLEM TO BE SOLVED: To obtain a silicon carbide composite body having a high heat conductivity of >=200 W/mK. SOLUTION: An aluminum-base metal is infiltrated into a porous silicon carbide compact to obtain the objective silicon carbide composite body having >=50 vol.% silicon carbide content. Silicon carbide particles having >=40μm particle diameter in the composite body account for >=55 wt.% of all silicon carbide particles and silicon carbide particles having <=15μm particle diameter account for <=45 wt.%. The heat conductivity of the composite body at room temperature is >=200 W/mK.
申请公布号 JP2000154080(A) 申请公布日期 2000.06.06
申请号 JP19980322056 申请日期 1998.11.12
申请人 DENKI KAGAKU KOGYO KK 发明人 HIRUTA KAZUYUKI;NAGASAKI HIRONORI;TERASAKI RYUICHI
分类号 H01L23/373;C04B41/51;C04B41/88;(IPC1-7):C04B41/88 主分类号 H01L23/373
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