发明名称 |
SILICON CARBIDE COMPOSITE BODY |
摘要 |
PROBLEM TO BE SOLVED: To obtain a silicon carbide composite body having a high heat conductivity of >=200 W/mK. SOLUTION: An aluminum-base metal is infiltrated into a porous silicon carbide compact to obtain the objective silicon carbide composite body having >=50 vol.% silicon carbide content. Silicon carbide particles having >=40μm particle diameter in the composite body account for >=55 wt.% of all silicon carbide particles and silicon carbide particles having <=15μm particle diameter account for <=45 wt.%. The heat conductivity of the composite body at room temperature is >=200 W/mK.
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申请公布号 |
JP2000154080(A) |
申请公布日期 |
2000.06.06 |
申请号 |
JP19980322056 |
申请日期 |
1998.11.12 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
HIRUTA KAZUYUKI;NAGASAKI HIRONORI;TERASAKI RYUICHI |
分类号 |
H01L23/373;C04B41/51;C04B41/88;(IPC1-7):C04B41/88 |
主分类号 |
H01L23/373 |
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地址 |
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