发明名称 |
Flexible skin incorporating mems technology |
摘要 |
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 mu m thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 mu m) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). |
申请公布号 |
US6071819(A) |
申请公布日期 |
2000.06.06 |
申请号 |
US19980012756 |
申请日期 |
1998.01.23 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
TAI, YU-CHONG;JIANG, FUKANG;HO, CHIHMING |
分类号 |
B81B3/00;B81B7/00;B81C1/00;H01L21/301;(IPC1-7):H01L21/311 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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