| 摘要 |
PROBLEM TO BE SOLVED: To obtain a reactive hot melt adhesive composition capable of being cured by the irradiation with active energy rays and expressing excellent heat resistance after being cured, by making the composition contain an epoxy compound with polycaprolactone and a cation polymerization initiator. SOLUTION: This reactive hot melt adhesive composition comprises (A) an epoxy compound, (B) polylcaprolactone in an amount of 5-1,000 pts.wt., preferably 10-500 pts.wt., per 100 pts.wt. of the component A, and (C) a cation polymerization initiator in an amount of preferably 0.01-10 pts.wt., more preferably 0.1-10 pts.wt., per 100 pts.wt. of the total amount of the components A and B. The component A is preferably an aromatic epoxy resin such as the polyglycidyl ether of a polyhydric phenol having two or more aromatic unclei and its hydrogenation product or brominated product. The component B is preferably polycaprolactone having one or more, preferably two or more, epoxy groups in the molecule.
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