| 摘要 |
PURPOSE: A device for producing a semiconductor package is provided to bump a solder ball for a row unit in a semiconductor chip on a wafer by adopting the bumping block of a structure that it is arranged in parallel by row and to promote efficiency of bumping operation by adopting a method for selectively controlling the bumping block according to requirements. CONSTITUTION: A tool for bumping a solder ball is composed of a tool body(13) installed in a tool loading unit, a bumping block(16) holding the solder ball, a moving instrument(20) of plate for including a cylinder(17), and a pin plate922) protecting the bumping block. Herein, the tool body is formed in a square bar with a certain length for containing an upper part and a lower part having cylindrical tool connector(10) and a block installer(1). And the tool connector is the connected unit by using vacuum pressure generated in the tool loading unit while keeping sealing, and the block installer is a square groove for settling the bumping block. Herein, the bumping block holds the solder ball while being fixed in the block installer of the tool body in a bolt binding method.
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