| 摘要 |
<p>PURPOSE:To decrease the signal strain at high speed and high frequency, and to reduce the voltage drop of the power supply system and the power supply noise by separating the signal input and output terminals and the power supply terminal, and taking out them from separate surfaces of a multilayered ceramic substrate. CONSTITUTION:An LSI chip 3 is mounted on the surface of a resin wiring layer 2 on a multilayered ceramic substrate 1, and input and output pads P1 and P2 are formed on the periphery of the same surface and a power terminal 10 is provided on the opposite surface. The signal terminal of the LSI chip 3 is connected to the input and output pads P1 and P2 through an internal wiring 8 for impedance control of the multilayer ceramic substrate 1 and the resin wiring 2, and the power supply terminal 10 is connected to the power supply terminal of the LSI chip 3 through a power supply layer 7 provided in the inner layer of the multilayered ceramic substrate 1 and a power supply via hole 9 in the signal layer. Since the power supply path can be shortened substantially to the thickness of the multilayered ceramic substrate regardless of the position, the effect of the power supply noise by inductance can be greatly reduced.</p> |
