| 摘要 |
<p>PURPOSE:To properly evaluate the holding efficiency of a vacuum pincette when the pincette holds a wafer in the manufacturing process of a semiconductor. CONSTITUTION:The lateral part in the outer periphery of the rear surface of a wafer 2 in the vertical state is sucked and held by an end part 1 of a vacuum pincette. As the downward force works at the opposite side of the outer peripheral part, the force when the wafer 2 starts to drop or slide is measured. In another way, the lateral part of the outer periphery of the rear surface of the wafer 2 in the vertical state is sucked and held by the end 1 of the vacuum pincette. By reducing the evacuation efficiency of the vacuum pincette, the evacuation pressure waxen the wafer starts to drop or slide is measured.</p> |
