RETAINING RING OF CHEMICAL AND MECHANICAL POLISHING DEVICE

摘要

PURPOSE: A retaining ring is provided to regularly distribute slurries on the surface of a wafer polished by the polishing head of a chemical and mechanical polishing(CMP) equipment, and to extend the life span of a pad. CONSTITUTION: A retaining ring(140) has so many grooves(160) as slurry passages. The section of the groove is in a round shape. Therefore, the retaining ring smoothly supplies slurries and extends the life span of a polishing pad by reducing abrasion amount of the pad. The retaining ring is placed in the bottom edge of a polishing head, covers a wafer(120) and prevents the wafer from moving. The slurry is regularly dispersed on the surface of the wafer as supplied through the groove.