DEVICE FOR MEASURING TEMPERATURE OF PLATE USING TEMPERATURE RESISTANT BODY

摘要

PURPOSE: A device for measuring a temperature is provided to exactly measure the temperature of a hot plate for each position. CONSTITUTION: A device for measuring a temperature of a hot plate comprises of: a test wafer(101) for measuring the temperature of the hot plate; a temperature resistant body(102) formed on a surface of the test wafer(101); and a resistant system(103) displayed a resistant value measured in the temperature resistant body(102). A method for forming the temperature resistant body(102) in the test wafer(101) is deposited a heat insulating layer(104) for cutting a heat on the test wafer(101) by the heat resistant body(102) and a resistant layer(105) is deposed on the heat insulating layer(104). The heat insulating layer(104) is used materials such as an SiO2 and an SiN2, and the resistant layer(105) is used a polysilicon. The temperature resistant body(102) is measured the temperature of the hot plate in various points by forming many temperature resistant bodies on the test wafer(101), but is formed so a resistance as to be concentrated in a certain part of the hot plate measured the temperature.