DEVICE FOR PRODUCING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A device for producing a semiconductor package is provided to smoothly operate a punch by preventing impurities from attaching to the punch or to a punch hole, to improve operating efficiency and to reduce defect rate by protecting the punch from being damaged. CONSTITUTION: An operating hole(22) and a punch hole(32) are produced in a long rectangle the same with the section of a punch(21). Herein, the guide grooves(23,33) are formed in the operating hole and the punch hole to lengthwise to prepare a space between the holes and the punch for the punch to operate smoothly. Therefore, an impurity generated while processing is prevented from being attached to the operating hole or to the punch hole, and the punch is operated fully. Herein, the guide groves are formed in the punch hole with a certain interval.