发明名称 APPARATUS FOR DRIVING LEAD SCREW OF SEMICONDUCTOR
摘要 PURPOSE: An apparatus for driving a lead screw of a semiconductor device is provided to automate a gris exchange work to remove the gris more precisely, exchange the gris with the same level, increase the productivity of an equipment, use parts long, and make the lubrication action of the barring smoothly. CONSTITUTION: An apparatus for driving a lead screw of a semiconductor device includes a lead screw(8) of which both ends are rotated and supported by a base and which is rightly and reversely rotated by a motor, a movable equipment on which a wafer is loaded and penetrated by the lead screw and which does a rectilinear back and forth motion, a stick(13) for removing a gris, a stick(15) for coating a gris, and a stick attachment and detachment movement unit. The stick for removing a gris is to inhale a gris with vacuum to remove an old gris adhered to the lead screw. The stick for coating a gris is to coat a new gris on the lead screw removed the gris. The stick attachment and detachment movement unit is fixed to the movable equipment. The stick for removing a gris and the stick for coating a gris are accessed and separated to the one side of the lead screw by the stick attachment and detachment movement unit.
申请公布号 KR20000031965(A) 申请公布日期 2000.06.05
申请号 KR19980048238 申请日期 1998.11.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SEOK WOO
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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