| 摘要 |
PURPOSE: A loading and unloading device is provided to remove the complication to shift an arriving part according to a size of a semiconductor device by remodeling the arriving part to put every semiconductor devices of different sizes on one arriving part. CONSTITUTION: When a distance between guide blocks(250) is set, an electric test and a stress test are proceeded by inserting a semiconductor device(120) proved as a good product through a first test into a socket of a burn-in board, and by inputting the burn-in board inserted the semiconductor device(120) into a burn-in chamber. The semiconductor device(120) divided to various kinds of grades by passing the test is transferred to an alignment device(200), and the semiconductor device(120) transferred to the alignment device(200) is aligned with the socket(134) of a tray(132) put in a unloading part(130) by arriving between guide blocks(150). When the socket(134) of the tray(132) and the semiconductor device(120) are aligned, a sorting device puts in the socket(134) of the tray(132) put in the unloading part(130) by picking up the semiconductor device(120) inserted to a storing groove(222) with a vacuum. When a control unit of length is installed in the alignment device(200), the complication to shift the arriving part according to a size of the semiconductor device input in the loading and unloading equipment(100) is removed.
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