| 摘要 |
PURPOSE: A semiconductor package of a chip scale is provided to be light weighted and to have excellent reliability by sawing along a cut line and packaging separately after packaging in a group on a wafer. CONSTITUTION: Polyimide Isoindro Quindzoline or the material of low modulus is coated on the front surface of a wafer for forming a buffer layer(2) on the upper surface of a semiconductor chip(1). Then, a bonding pad(100) area of the buffer layer is patterned and etched for exposing the bonding pad of the semiconductor chip, and copper is sprayed and patterned on the buffer layer for forming a conductive wire(3). Also, the bonding pad of the semiconductor chip and the conductive wire are bound by using a wire having fine width for being electrically connected, and the bonding pad of the semiconductor chip and a gold wire(4) are sealed by using an encapsulation resin(5). And a solder ball(6) is attached in a certain location of the conductive wire located in the area not sealed by the encapsulation resin. Herein, semiconductor device appeared on the wafer is individually packaged through a sawing process for being mounted on a printing circuit board.
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