发明名称 Flexible circuits and carriers and process for manufacture
摘要 A flexible circuit carrier including at least one layer of polymer dielectric material, at least one layer of conductive material thereover, each layer having two major surfaces, at least one of said layers having at least one aperture therein, wherein at least one layer has a material coated on at least a portion thereof having a Young's Modulus of from about 100 to about 200 GPa, a dielectric constant (between 45 MHz and 20 GHz) of from about 8 to about 12, and a Vickers hardness of from about 2000 to about 9000 kg/mm2.
申请公布号 US6071597(A) 申请公布日期 2000.06.06
申请号 US19970919883 申请日期 1997.08.28
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 YANG, RUI;TRUONG, THACH G.;MOONEY, JUSTINE A.;DAVID, MOSES M.
分类号 H01L21/60;H01L23/498;H01L23/538;H05K1/00;H05K3/28;H05K3/38;(IPC1-7):B32B9/00 主分类号 H01L21/60
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