发明名称 Thermally buckling linear micro structure
摘要 A thermally buckling linear micro structure, in which by isolating technology a thermal oxidization isolation layer are generated on the two ends of a micro structure, or a material with larger thermal inflation coefficient is deposited, or the area of thermal conduction is reduced so that the two ends of a micro structure has a larger thermal stress and the membrane structure may be heated uniformly so to cause a thermally buckling deformation, therefore, the deformation of the membrane type micro structure is amplified linearly with the input power. This micro structure is formed as a membrane type by a membrane manufacturing technology.
申请公布号 US6070851(A) 申请公布日期 2000.06.06
申请号 US19980092905 申请日期 1998.06.08
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 TSAI, MING-JYE;HUANG, RUEY-SHING;WU, CHING-YI
分类号 B81B3/00;F04B43/04;F15C5/00;F16K99/00;(IPC1-7):F16K31/02;F16K31/70 主分类号 B81B3/00
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