发明名称 |
Thermally buckling linear micro structure |
摘要 |
A thermally buckling linear micro structure, in which by isolating technology a thermal oxidization isolation layer are generated on the two ends of a micro structure, or a material with larger thermal inflation coefficient is deposited, or the area of thermal conduction is reduced so that the two ends of a micro structure has a larger thermal stress and the membrane structure may be heated uniformly so to cause a thermally buckling deformation, therefore, the deformation of the membrane type micro structure is amplified linearly with the input power. This micro structure is formed as a membrane type by a membrane manufacturing technology.
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申请公布号 |
US6070851(A) |
申请公布日期 |
2000.06.06 |
申请号 |
US19980092905 |
申请日期 |
1998.06.08 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
TSAI, MING-JYE;HUANG, RUEY-SHING;WU, CHING-YI |
分类号 |
B81B3/00;F04B43/04;F15C5/00;F16K99/00;(IPC1-7):F16K31/02;F16K31/70 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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