发明名称 |
Wire bonding apparatus and control method thereof |
摘要 |
In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.
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申请公布号 |
US6070778(A) |
申请公布日期 |
2000.06.06 |
申请号 |
US19980079215 |
申请日期 |
1998.05.14 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
TAKAHASHI, KUNIYUKI;HAYASHI, HIJIRI |
分类号 |
H01L21/60;B23K20/00;(IPC1-7):B23K37/00;B23K13/08;B23K15/02;B23K31/00;B23K31/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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