| 摘要 |
<p>The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100 νm; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25 νm between the electronic device and the circuit substrate. The circuit package is less than about 275 νm thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.</p> |
