| 摘要 |
An ultrasonic transducer assembly (54) includes a transducer (58) mounted in a housing (56), the transducer including a piezoelectric element (60), and a respective matching (62), and backing (64) layers formed on the opposite sides thereof, the transducer (58) mounted in the housing (56) encapsulated with a non-conductive potting material (72). A portion of the matching layer is removed, e.g., by etching, to expose a portion of an underlying electrode (66) formed between the piezoelectric element, and the matching layer. A portion of the non-conductive potting material between the etched portion of the matching layer, and a signal wire (68) disposed in the housing is also removed. The respective voided portions (76) of the matching layer, and non-conductive potting material are filled with an electrically conductive matching material to electrically couple the electrode, and, thus, the piezoeletric element, to the signal wire. |
