| 摘要 |
A system is provided for cooling electronic components and for localized cooling of selected electronic components. An air mover (32) is mounted adjacent to an exhaust opening in order to generate a low pressure zone within the cabinet's interior. An inlet opening (28) is defined in a cabinet so that the air mover can generate a serial air flow path extending from the inlet opening to the exhaust opening for cooling of electronic components within the cabinet. At least one secondary opening (36) is defined in the cabinet so that the air mover can generate a parallel air flow path, for cooling of selected electronic components, that extends from the secondary opening and then joins the serial air flow path.
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