| 摘要 |
A device (1, 21, 28, 36, 37, 86, 103, 121, 128) for electronic packaging, the device including a discrete solid body having a pair of opposing generally parallel major surfaces, the solid body having a body portion of a porous valve metal oxide based material with a pair of exterior surfaces respectively constituting portions of the major surfaces and extending inward from one major surface towards the other major surface, the body portion having one or more electrically insulated valve metal conductive traces of from about 10 mu m to about 400 mu m thickness in a direction from one major surface to the other major surface embedded therein, one or more of said traces having a trace portion divergingly extending inward from an exterior surface constituting a portion of one of said major surfaces. A pin jig fixture (221, 232) for use with an electrical power source for porous anodization of a valve metal blank having a surface, the pin jig fixture comprising a bed of pins each having a leading end surface for intimate juxtaposition against the surface for masking a corresponding area thereof, one or more of said leading end surfaces being directly connected to the electrical power source for electrically connecting the electrical power source to the surface on intimate juxtaposition thereagainst. |
