| 摘要 |
<p>An electroless silver plating solution for electronic parts, characterized as comprising a silver salt, a complexing agent for silver, a fluorine-containing surfactant and a buffer salt for pH. The plating solution exhibits an effect of preventing migration phenomena and provides a plating bath having a long life. The silver salt is preferably silver nitrate, and the complexing agent for silver is preferably one or more of succinimide and phthalimide. The plating solution preferably contains 0.05 to 30 g/liter of silver ion, 0.1 to 200 g/liter of one or more of succinimide and phthalimide and 0.01 to 10 g/liter of a fluorine-containing surfactant. Further, the plating solution preferably contains an inorganic acid and/or an organic acid as the buffer salt for pH.</p> |
