| 摘要 |
<p>A method of manufacturing an electronic device comprising two layers of organic-containing material comprises the steps of: applying a first layer (3) of organic-containing material to a substrate (1), covering the first layer (3) of organic-containing material with a first layer (4) of inorganic material, applying a second layer (5) of inorganic material which is different from the inorganic material of the first layer (4), providing a first mask layer of resist having first openings (7), etching through the second layer (5) of inorganic material at the location of the first openings (7) using an etch process wherein the second inorganic material is selectively etched with respect to the first inorganic material, removing the first mask layer of resist, etching through the first layer (4) of inorganic material at the location of the first openings (7), applying a second layer (13) of organic-containing material, covering the second layer (13) of organic-containing material with a third layer (14) of inorganic material, applying a fourth layer (15) of inorganic material which is different from the inorganic material of the third layer (14), providing a second mask layer of resist having second openings (17), etching through the fourth layer (15) of inorganic material at the location of the second openings (17) using an etch process wherein the fourth inorganic material is selectively etched with respect to the third inorganic material, removing the second mask layer of resist, etching through the third layer (14) of inorganic material at the location of the second openings (17), simultaneously etched through the second layer (13) of organic-containing material at the location of the second openings (17) and the first layer (3) of organic-containing material at the location of the first openings (7).</p> |
