ELECTROLESS SILVER PLATING SOLUTION FOR ELECTRONIC PARTS

摘要

An electroless silver plating solution for electronic parts, characterized as comprising a silver salt, a complexing agent for silver comprising a hydantoin compound, a fluorine-containing surfactant and a buffer salt for pH. The plating solution exhibits an effect of preventing migration phenomena and provides a plating bath having a long life. The plating solution preferably contains 0.05 to 30 g/liter of silver ion, 0.1 to 200 g/liter of a hydantoin compound and 0.01 to 10 g/liter of a fluorine-containing surfactant. Further, the plating solution preferably contains an inorganic acid and/or an organic acid as the buffer salt for pH and at least one compound selected from among hydantoin, 5,5-dimethyl hydantoin, 1,3-dimethyl hydantoin and 1-methyl hydantoin as the hydantoin compound.