发明名称 POLYSTYRENE-BASED RESIN COMPOSITION FOR INJECTION MOLDING
摘要 Disclosed is a polystyrene-based resin composition for an injection molding. The composition comprises a mixture of a first and a second styrene compositions having rubbers of different particle sizes, wherein the first styrene composition includes 6-8% of the rubber having the particle diameter of 3-5 mu m, and the second styrene composition includes 7-9% of the rubber having the particle diameter of 1-3 mu m. The large-sized rubber particles and the small-sized rubber particles contact closely after the injection molding and then the exterior view of the mould product can be further improved. And the forming of a weld line is restrained.
申请公布号 WO0031182(A1) 申请公布日期 2000.06.02
申请号 WO1999KR00003 申请日期 1999.01.04
申请人 DAEWOO ELECTRONICS CO., LTD. 发明人 CHO, CHAE, SUNG
分类号 B29C45/00;B29K25/00;B29K105/16;C08F279/02;C08F291/02;C08L21/00;C08L25/04;C08L25/06;C08L83/04 主分类号 B29C45/00
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