发明名称 |
POLYSTYRENE-BASED RESIN COMPOSITION FOR INJECTION MOLDING |
摘要 |
Disclosed is a polystyrene-based resin composition for an injection molding. The composition comprises a mixture of a first and a second styrene compositions having rubbers of different particle sizes, wherein the first styrene composition includes 6-8% of the rubber having the particle diameter of 3-5 mu m, and the second styrene composition includes 7-9% of the rubber having the particle diameter of 1-3 mu m. The large-sized rubber particles and the small-sized rubber particles contact closely after the injection molding and then the exterior view of the mould product can be further improved. And the forming of a weld line is restrained. |
申请公布号 |
WO0031182(A1) |
申请公布日期 |
2000.06.02 |
申请号 |
WO1999KR00003 |
申请日期 |
1999.01.04 |
申请人 |
DAEWOO ELECTRONICS CO., LTD. |
发明人 |
CHO, CHAE, SUNG |
分类号 |
B29C45/00;B29K25/00;B29K105/16;C08F279/02;C08F291/02;C08L21/00;C08L25/04;C08L25/06;C08L83/04 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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