| 发明名称 |
Semiconductor chip and method of manufacturing the same |
| 摘要 |
<p>A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate (1). The chip includes at least one recess portion (5) formed in the lower surface of the semiconductor substrate (1). The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed. <IMAGE></p> |
| 申请公布号 |
EP0884778(A3) |
申请公布日期 |
2000.05.31 |
| 申请号 |
EP19980250158 |
申请日期 |
1998.05.09 |
| 申请人 |
NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
发明人 |
BAN, HIROSHI;TANNO, MASAAKI;TAKEDA, TADAO |
| 分类号 |
H01L21/306;(IPC1-7):H01L23/00;H01L27/02 |
主分类号 |
H01L21/306 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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