发明名称 OXIDATIVE TOP ELECTRODE DEPOSITION PROCESS, AND MICROELECTRONIC DEVICE STRUCTURE
摘要 <p>A method of preventing oxygen deficiency in a ferroelectric or high ε film material (114) having a top electrode layer (113) deposited thereon. Process conditions are employed that either enable the top electrode layer to be formed without oxygen abstraction from the ferroelectric or high ε film material in the vicinity and at the top surface thereof, or else provide the ferroelectric or high ε film material in the vicinity and at the top surface thereof with a surplus of oxygen. In the latter case, the depositing formation of the top electrode layer on the ferroelectric or high ε film material depletes the over-stoichiometric excess of the oxygen in the film material, to yield a device structure including an electrode on a film material having a proper stoichiometry, e.g., of PbZrTiO3.</p>
申请公布号 WO2000031792(A1) 申请公布日期 2000.06.02
申请号 US1999027753 申请日期 1999.11.23
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