发明名称 |
Semiconductor device and method of its fabrication |
摘要 |
In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads (3) is disposed so as to extend over the surface of a semiconductor element (1), the chip support is bonded and fixed to the surface of a polyimide wafer coat (9) on the semiconductor element (1) by means of an insulating tape, the leads (3) are brought into contact with the polyimide wafer coat (9) on the semiconductor element (1) without being fixed, the leads (3) and the electrodes of the semiconductor element (1) are connected by means of gold wires (6), and these are packaged by a packaging material (7). Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced. <IMAGE> |
申请公布号 |
EP0807972(A3) |
申请公布日期 |
2000.05.31 |
申请号 |
EP19970107671 |
申请日期 |
1997.05.09 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
OHUCHI, SHINJI;KAWANO, HIROSHI;YAMADA, ETSUO;SHIRAISHI, YASUSHI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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