发明名称 |
Encapsulated communication device |
摘要 |
<p>Reaction injection molding is used to provide a communications device, e.g., a telephone handset, having a body that contains internal electronics and polymeric material that substantially fill the entire volume of the body. The body thus consists of the internal electronics surrounded or encapsulated by a continuous mass of the polymeric material. <IMAGE></p> |
申请公布号 |
EP1005207(A2) |
申请公布日期 |
2000.05.31 |
申请号 |
EP19990309096 |
申请日期 |
1999.11.16 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
DECKER, ROBERT LEROY;WELD, JOHN DAVID |
分类号 |
H05K5/02;B29C45/00;B29C45/14;H04M1/02;H04M1/03;(IPC1-7):H04M1/03 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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