发明名称 |
Insulating material and windings thereby |
摘要 |
The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.
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申请公布号 |
US6069430(A) |
申请公布日期 |
2000.05.30 |
申请号 |
US19990257013 |
申请日期 |
1999.02.25 |
申请人 |
HITACHI, LTD. |
发明人 |
TSUNODA, TOMOYA;MORIKAWA, KEIICHI;ONODA, MITSURU;AMAGI, SHIGEO;HONDA, TATSUO |
分类号 |
H01F5/06;H01B3/30;H01B7/02;H01B17/60;H02K3/34;H02K3/40;(IPC1-7):H02K1/00 |
主分类号 |
H01F5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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