发明名称 Insulating material and windings thereby
摘要 The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.
申请公布号 US6069430(A) 申请公布日期 2000.05.30
申请号 US19990257013 申请日期 1999.02.25
申请人 HITACHI, LTD. 发明人 TSUNODA, TOMOYA;MORIKAWA, KEIICHI;ONODA, MITSURU;AMAGI, SHIGEO;HONDA, TATSUO
分类号 H01F5/06;H01B3/30;H01B7/02;H01B17/60;H02K3/34;H02K3/40;(IPC1-7):H02K1/00 主分类号 H01F5/06
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