| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate placement device with less dust and high thermal conductivity. SOLUTION: Related to a substrate placement device 11 provided on a bottom wall side of a vacuum vessel 1, an elastic member 18 is fitted inside the recessed part on the surface of a dielectric body 12. The surface of elastic member 18 is higher than the surface of dielectric body 12, and when, with a substrate 7 placed on the elastic member 18, the electrodes 13 and 14 provided inside the dielectric body 12 are applied with a voltage, an electrostatic attraction force is applied to the substrate so that the elastic member 18 so compressed that the rear surface of the substrate 7 contacts the surface of the dielectric body 12. Since the contact area to the elastic member 18 is large even when the substrate 7 is thermal-expanded, less dust is caused. Further, since the rear surface of the substrate 7 is forced to tightly contact the surface of the elastic member 18 under the restoring force of the elastic member 18, a thermal conductivity is high.</p> |
