| 摘要 |
PROBLEM TO BE SOLVED: To enable ensuring high bonding strength between a control terminal and sealing resin while the external size of a package of a plastic molded type semiconductor device is restrained to be small. SOLUTION: A power element 1 and a control element 2 are mounted by using a lead frame 3, and a heat dissipating metal plate 4 is arranged on the back side of a lead frame. The periphery of the heat dissipating metal plate 4 is collectively sealed with resin 6, and a plastic molded type semiconductor device is constituted. In this case, a lead segment of a control terminal 3d which is connected with the control element 2 through a wire and is led out from a package to the side direction is made a straight shape, and a notched and recessed part 3d-1 is formed in an inner lead part of the control terminal buried in a sealed resin layer, and anchor-bonded with the sealed resin. As a result, bonding strength between the control terminal and the resin is increased, and the control terminal does not simply come out from the package when an external force F is applied. |
