| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having nozzle cleaning function and a method of substrate processing using the same, which can suppress consumption of processing solutions such as coating solution and developing solution to reduce running cost needed for the substrate processing. SOLUTION: Coating solution is sucked from a nozzle 1 to pull back a specified amountΔQ2 of the coating solution from a nose part 15 of the nozzle 1 to the inside of the nozzle in advance of the nozzle cleaning process. Since the nozzle cleaning process is to be conducted at this situation, the cleaning solution is precluded to be in contact with the coating solution, and a bad influence of lowering the concentration of the coating solution or the like is prevented. Besides, after the nozzle cleaning process is completed, the same amountΔQ2 of the coating solution as that in the sucking process is ejected to the nozzle 1 to discharge the cleaning solution remaining in the nose part so that the coating process is ready to be conducted.
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