| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate manufacture of a cathode, by forming an opening on an insulating film laminated on an emitter electrode, and on the region composing pixels of a gate electrode film, and by forming a plating film by an electroplating method, so as to at least cover the side of the gate electrode film exposed in the opening and to reduce the opening, and by forming an emitter tip material layer in the opening. SOLUTION: An emitter electrode 117, an insulating film 118, and a gate electrode 119 are laminated in this order, to thereby form a substrate surface pattern. Then, in order to reduce the caliber of an opening, a metal plating film 133 by an electroplating method is formed both on the upper part of the gate electrode 119 and on the side of the opening, to thereby reduce the caliber of the opening up to about 1μm. After the plated negative electrode plate is pulled up from the plating solution and washed, etching of the unopened insulating film 118 is executed. If only removal of the insulating film 118 in the opening is selectively executed by RIE or hydrofluoric acid etching, a space for forming an emitter tip can be secured.</p> |
