| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliable wiring board having a three layer integrated structure. SOLUTION: This wiring board has a three-layer integrate structure in which a built-up layer B1, which comprises insulation layers I1, I2 and conductive layers (C1, C2)are laminated alternately, are bonded in the state where they are interposed between rigid core boards 3, 4. An upper side core board 4 on the surface layer side of the built-up layer B1 is provided with a plurality of socket-like construction parts 24, 24A. Every construction parts 24, 24A are interconnected with the conductive layer (C1). |
