发明名称 METHOD AND DEVICE FOR SUBSTRATE THERMAL PROCESS
摘要 PROBLEM TO BE SOLVED: To prevent deflection or transfer from occurring by transferring a substrate to be processed to a heating stage by a first transfer means, and delivering the substrate processed with remaining-heat to the first transfer means by a second transfer means. SOLUTION: A substrate 62 with a resist liquid coated which is received from a main arm mechanism 24 is firstly held by a transfer pin 73 of relatively low temperature for process at remaining heat. In this process with remaining heat, most of sublimates (such as solvent) are sublimated from a resist liquid. When the temperature difference between the substrate 62 and a transfer pin 71 almost disappears, the substrate 62 is delivered to the transfer pin 71 from the transfer pin 73, and then transferred to a hot plate 60 by the transfer pin 71, for regular heating. Thus, a fluctuation in a resist film pressure caused by the temperature change of the transfer pin 71 and the substrate 62 is prevented, with occurrence of a transfer trace prevented. Related to the substrate 62, sublimation of solvent, etc., is sufficiently performed from the resist liquid under a remaining heat, so the fluctuation of the resist film pressure or deflection of the substrate is prevented.
申请公布号 JP2000150359(A) 申请公布日期 2000.05.30
申请号 JP19980328422 申请日期 1998.11.18
申请人 TOKYO ELECTRON LTD 发明人 SAKAMOTO TAKAHIRO
分类号 H01L21/027;G03F7/38;(IPC1-7):H01L21/027 主分类号 H01L21/027
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