RESIN SEALED SEMICONDUCTOR DEVICE AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To relax warp of a package and decrease bonding defect in a process for connection with a semiconductor element by a bonding wire. SOLUTION: A bonding tape 15 for fixing a lead 13 to a semiconductor element (chip) 11 of an LOC(lead.on.chip) type package is extended to a region wherein a chip in a horizontal direction at right angles to a thickness direction of a package does not exist. The bonding tape 15 is bent along an outer side surface of a chip and extended to a region wherein a chip does not exist again. As a result, it can be arranged at a center of a package. Furthermore, a rigid base can be interposed at a center of the bonding tape 15 for providing it with strength. It is possible to relax warp of a package consisting of a resin sealing body 18 and to decrease bonding defect in a process for connection with a semiconductor element by a bonding wire 17.