| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method thereof with high connection reliability obtained when a high-density wiring is formed in a limited area of the printed wiring board. SOLUTION: A basic fiber material such as aramid nonwoven fabric, etc., is impregnated with thermosetting resin such as epoxy resin, etc., to make a board 1 half-cured, then organic films 2 are applied on both surfaces of the board 1. After that, a plurality of through-holes are formed, the board 1 is placed on a sheet 4. The pressure difference is produced by sucking and pressure-reducing at the lower surface side of the board 1 so that the upper surface side of the board 1 may have a higher pressure than that of the lower surface side. Then, conductive paste 7 applied on the surface of a pressing plate 6 is arranged on the upper surface of the board 1, and pressure is applied. As a result, the through-holes are filled with the conductivity paste 7 with high density.
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