| 摘要 |
PROBLEM TO BE SOLVED: To obtain a jet soldering apparatus that is capable of stabilizing preheating conducted before a substrate is subjected to contact the solder jet and is capable of reducing the size of the apparatus. SOLUTION: A substrate 4 on which electronic components are loaded is preheated by passing through on a pre-heater 5 having a radiating plane on its upper surface, and the preheated substrate 4 is subjected to contact the solder jet to solder the electronic components to the substrate 4. In these processes, a shield plate 44 that is higher than the radiating plane 5a is arranged around the periphery of the radiating plane 5a of the pre-heater 5; the substrate 4 on which electronic components are loaded is placed on the radiating plate 5a of the pre-heater 5; and after keeping this condition for a specified time, the substrate 4 is subjected to contact the solder jet.
|
