摘要 |
PROBLEM TO BE SOLVED: To make positioning and handling easy and reduce the number of components by forming a reinforcing layer with resin and printing around through-holes or notches located at specified positions in an insulating film to form a wiring board. SOLUTION: Electrically conductive patterns 2 are formed by etching a copper foil pasted on an upper face of a flexible insulating film 1 such as of polyethylene-terephthalate, polyimide or the like, or by printing a flexible resin such as polyester, epoxy or the like, in which silver, carbon or the like is dispersed. An insulating layer 3 of polyester, epoxy or the like is printed on the middle part of the conductive patterns 2 excluding connecting parts 2A and 2B on both ends so as to cover the conductive patterns 2. A reinforcing layer 21 is formed by printing polyester, epoxy or the like around through-holes 20A and notches 20B formed in tongue-shaped parts 1A and 1B, respectively, of the insulating film 1 to construct a wiring board for connecting purpose.
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