发明名称 WIRING BOARD, MANUFACTURE THEREOF, AND METHOD OF MOUNTING THE SAME TO APPARATUS
摘要 PROBLEM TO BE SOLVED: To make positioning and handling easy and reduce the number of components by forming a reinforcing layer with resin and printing around through-holes or notches located at specified positions in an insulating film to form a wiring board. SOLUTION: Electrically conductive patterns 2 are formed by etching a copper foil pasted on an upper face of a flexible insulating film 1 such as of polyethylene-terephthalate, polyimide or the like, or by printing a flexible resin such as polyester, epoxy or the like, in which silver, carbon or the like is dispersed. An insulating layer 3 of polyester, epoxy or the like is printed on the middle part of the conductive patterns 2 excluding connecting parts 2A and 2B on both ends so as to cover the conductive patterns 2. A reinforcing layer 21 is formed by printing polyester, epoxy or the like around through-holes 20A and notches 20B formed in tongue-shaped parts 1A and 1B, respectively, of the insulating film 1 to construct a wiring board for connecting purpose.
申请公布号 JP2000151033(A) 申请公布日期 2000.05.30
申请号 JP19980324697 申请日期 1998.11.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAHARA TETSURO;ASANO MASAHIKO;KIKUTA HIROBUMI;ABE YOSHIHARU
分类号 B23P21/00;H05K1/02;H05K3/28;(IPC1-7):H05K1/02 主分类号 B23P21/00
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