| 摘要 |
PROBLEM TO BE SOLVED: To further raise mounting strength to a mounting substrate by improving reliability of junction by soldering. SOLUTION: The device is constituted by sealing a semiconductor chip 17 inside a resin sealing package 20 and extending a plurality of outer leads 12 by a short size out of a lower circumferential edge part of the resin sealing package 20. A lower surface and an extension direction side surface of the outer lead 12 which is extended out of the resin sealing package 20 are made a fixing surface when surface mounting, etc., are performed for a mounting substrate.
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