| 摘要 |
PROBLEM TO BE SOLVED: To cope with large scale integration, to facilitate connection with an external circuit and to enhance compatibility in a high frequency module. SOLUTION: This module is provided with a metallic lower plate 3 on which a semiconductor bare chip 2 for a high frequency circuit is mounted and which has a hole 3a for forming a waveguide performing the input-output of a high frequency, an organic substrate 4 having a high frequency circuit 4c electrically connected to the bare chip and a metallic upper plate 5 which is laminated with the metallic lower plate with the organic substrate between them in a non-contact state with the high frequency circuit. On the organic substrate, a direct current bias for being connected to other circuit substrates and an intermediate frequency interface I are formed on a part coming out beyond the metallic lower and upper plates.
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